L1 LED Package
- Using flip chip LED to achieve high efficiency and better reliability.
- Produts includes single package (1-in 1) and mutli package (N-in 1) to meet different customer’s requirement.
- Ultra black package process to achieve the high contrast ratio and products uniformity.
High quality flatness / economic large size displa.
- With flexibility on module design, to achieve high black ratio and high brightness on products.
- Good production efficiency, and as well as the high brightness and high reliability on products.